Laser Technology for Electronic - Electronics and Computers
We utilize cutting-edge innovations in laser technology to develop our highly efficient and reliable processing systems for the Electronics industry. Ultrashort pulse laser technology guarantees optimum process results for drilling, scribing, cutting and structuring of PCB materials, ceramic substrates and semiconductor wafers.
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Galvanometer scanners or fixed optic process heads are used for positioning the laser beam on the workpiece, depending on the application requirements. Dual process head setups, also in mixed configuration (galvo scanner and fixed optic) are possible. This offers numerous advantages, such as higher productivity and the possibility to run different applications on one machine (e.g. micro-drilling and cutting).
The modular platform concept allows the customization of each laser system for the particular manufacturing task, as stand-alone- or inline-machine.
PCB
Laser drilling of blind vias and through holes in rigid and flex PCBs. Microvias with high aspect ratios and diameters < 50 µm. Trepanning or percussion drilling with ideal hole geometries in various PCB materials, such as RCC, FR4, FR5, polyimide and others.
Laser cutting of countours (routing) in rigid / flex PCBs and coverlayers. Clean and highly precise cuts with minimum cut width in various PCB materials, such as RCC, FR4, FR5, PTFE, CEM, polyimide and others.
Laser cutting of assembled and unassembled PCBs for depaneling. Clean and highly precise cuts with minimum cut width in various PCB materials, such as FR4, FR5, polyimide and others.
Laser structuring of the PCB's top copper layer with minimized damage to underlying materials (dielectric). Extremely fine structures < 100 µm with high precision and process repeatability.
Cavity Formation
Laser micromachining of cavities through copper and dielectric layers for microchip inserts. Precise control of ablation depth and geometry of the cavity, in combination with minimized thermal effects and high surface quality.
Ceramic
Laser scribing of ceramic substrates to generate a defined break line (perforation or groove) for singulation of the substrates. Fixed optic or galvo scanner based process, depending on laser source, application and material (AlOx, AlNi, DCB substrates, compound materials, etc.). Ultrashort pulse lasers generate burr-free scribe lines and reduce thermally induced tensions in the substrate through cold material ablation.
Laser cutting of ceramic substrates to form any desired shape (cut-outs, outlines). Fixed optic or galvo scanner based processing, depending on laser source, application and material (AlOx, AlNi, LTCC, HTCC, DCB substrates, compound materials, etc.). Ultrashort pulse lasers generate burr-free cuts and reduce thermally induced tensions in the substrate through cold material ablation.
Laser drilling of smallest hole diameters in trepanning or percussion mode. Microvias with diameters down to < 40 µm. Material range: AlOx, AlNi, LTCC, HTCC, DCB substrates, compound materials, etc. Ultrashort pulse lasers generate burr-free holes and reduce thermally induced tensions in the substrate through cold material ablation.
Laser micromachining of cavities in ceramic substrates for microchip inserts, etc. Nano- and picosecond laser technology allows precise geometry control of the cavity and ensures minimum thermal effects and high surface quality. Material range: AlOx, AlNi, LTCC, HTCC, DCB substrates, compound materials, etc.