3 services found
Silicon Valley Microelectronics, Inc. (SVM) Services
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Wafer Services
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Epitaxial Wafer Services
SVM supplies custom epitaxial layers on silicon wafers for research and development or large scale production. We process single crystalline epi layers on wafer diameters from 100mm to 200mm. Epitaxy is offered on bare wafers or those with buried layers, patterns or advanced device structures. All wafer substrates supplied by SVM for epitaxial processing are high quality, major manufactured factory sealed products. SVM carries a large inventory of ...
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Wafer Dicing Services
Wafer dicing is the process of sawing a wafer into its respective parts, called die. SVM dices silicon and other various types of wafer substrates, to any size required using precision diamond dicing blades. Dicing services are available for all wafer diameters ranging from 50mm to 300mm for both patterned and non-patterned wafer substrates. We specialize in processing very thin substrates with maximum yield. SVM provides pick and place and a large ...
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Wafer Annealing Services
Wafer Annealing is a high-temperature furnace operation that relieves stress in silicon, activates ion-implanted dopants, reduces structural defects and stress, and reduces interface charge at the silicon-silicon dioxide interface. SVM offers annealing solutions for wafers ranging in diameter from 25mm to 300mm. We provide many standard anneal recipes or can provide custom annealing to your specific ...