Incellplate
From Solar-Cell Back End
Integrated equipment and process solutions offer the most attractive alternative to any selective emitter approach.
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Features And Benefits
- Ni, Ag plating
- LIEP Ag process owned by Mac Dermid
- Suitable for Cu-technology
- Patented single side inline plating
- No backside protection required
- Reduction in Ag consumption compared to all available printing technologies up to 50 %
- High uptime due to dry soft touch backside contacting
- Low contact finger broadening
- Efficiency increase up to 0.6 % for Ni/Ag directly on silicon, depending on laser process
- Self aligning metallisation into laser opened structures
- Ag reclaim system – SH+E GROUP
- Up to 50 % Ag reduction on front side
- Contacting of high-ohmic emitters
- Efficiency increase up to 0.3 %*
- Depending on fine line print
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