MB - Model DW288 Series 3 - Wire Saw - Mastering Diamond Wire Technology
From Photovoltaic
With the DW288, the high speed and precision of diamond wire technology are a matter of course. The prizewinning DW288 is specially designed for the production of mono and multicrystalline wafers, and can be operated with both diamond wire technology or slurry. It is also intended for high output with extremely thin diamond wires, and works at highest speeds.
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Product Overview
The production of monocrystalline wafers at lowest cost and highest quality with maximum material utilization is simply unthinkable without slicing using diamond wire. The DW288 Series 3 is designed for use with extremely thin wires. This reduces kerf loss and maximizes the number of wafers per kilo of silicon.
The patented Diamond Wire Management System (DWMS) helps ensure longer usability of the diamond wire. Thereby, precise cutting is aided by the optimized axle spacing of the wire rolls, with a global thickness variation (TTV) of <10 µm.
Your Benefits
- Best quality is guaranteed: Higher wire tension for a more precise cut thanks to an innovative control system
- Highest throughput guaranteed: 30 m/s wire speed, 650 mm loading length, and a cutting time of less than two hours
- More yield per kilo of silicon thanks to wires as thin as a human hair, resulting in reduced kerf losses
- Lowest wire consumption thanks to the DWMS (1m/wafer)
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