Aster e Technologies
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Aster e Technologies products
Next-Generation Semiconductor Solutions
Aster - High Temp Oxidation Machine
High Temp Oxidation Furnace. Horizontal wafer batch processing. Dry & Wet Oxidation up to 1600°C. Oxygen free from 20°C. Automatic loading.
Up to 50 wafers per batch. Up to 200mm wafer size.
Aster - Semiconductor
PECVD R&D Platform. Direct Plasma, Low RF. Pin Mark Free, Color Uniform. Horizontal Wafer Process. Up to 25 wafers per batch. Compatible up to 200mm. In-situ Cleaning. SiN, SiON, a:Si, SiC, SiCxNy.