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ECO Physics AG applications
Focuses on high NOx, NOx-related and multigas-concentrations up to 10’000 ppm. Parameters included are NO, NO2, NOx, NH3, NOx-amines, O2 and CO2. The applications are characterized by demanding sample gas conditions, such as in automotive, aviation, naval, or combustive engine emissions, as well as in catalyst production.
NOx detection is an innovative approach in CMP (Chemical Mechanical Polishing) process control. CMP smoothens the wafer surface with a combined chemical and mechanical polishing procedure. During production, wafers are coated by a thin layer. To avoid damage to the wafer surface, for instance by stress cracks, the NOx emitted as soon as the wafer is plane and blank must be measured. Therefore, a high-resolution NOx-detector, capable of determining exactly when the polishing process must be stopped, is essential. This approach is used successfully in manufacturing and development lines worldwide, since 1996.