MacDermid Alpha Electronics Solutions products

Mild, yet very effective etch for precision formation of patterns through anti-reflective coatings.

Removes Helios inkjet resists from wafers quickly and effectively, leaving no residues. Environmentally friendly.

The Helios family of nickel solutions offers the PV designer a set of options for solar cell conductor formation. Achieve your target thickness at the optimal conditions for your process.  Full build, high purity, low stress nickel for fast deposition of up to 20 microns thickness. Provides conductor formation without copper exposure.

Full build, high purity, low stress copper for fast deposition of up to 50 microns thickness. For the ultimate finger and busbar conductivity. Easily finished with silver or tin. Available in light-induced formulation as well.

Cyanide-free. The highest conductivity metal deposit for use as a full build conductor, or the final coating on copper or nickel deposits.

Cyanide-free. The highest conductivity metal deposit for use as a full build conductor, or the final coating on copper or nickel deposits. Can be applied in LIP or fully electrolytic mode.

Silver deposition using the energy of a PV cell. This unique process relies on light, but not on contact electrodes. No contact means no breakage and perfect plating uniformity acrosss the wafer`s surface. Improve fine-line paste printing, or build a full conductor on a seed metal layer.

Protect the conductors for soldering with the most functional and cost competitive surface finish available. Helios Immersion Silver applies a sub-micron deposit of pure silver in high speed batch or conveyorized equipment without the need for electrolytic contact. A proven record of performance on millions of cells demonstrates significant benefits over other finishes or electrolytic coatings.