Meyer Burger products

The inner diameter saw TS 207 / 08 series crops mono-crystalline silicon ingots. During cropping the position of a cut on the ingot may be adjusted flexibly to guarantee highest yield. Test-wafers can be cut to thicknesses of 0.8 – 25 mm. Loading and unloading of the ingots can be done manually as well as semi-automatically.

The first-class surface of the wafers, as well as best warp and TTV values, make the DS 261 the leading wire saw in the semi-conductor industry. The DS 261 yields top technological and qualitative performances and is used in particular for cutting 12 inch wafers.