PCB Technologies Ltd products

We go beyond design limits to offer you cutting edge semiconductor and electronics assembly, testing and IC package design including LGA, BGA and 2D & 3D customized solutions. Featuring fully supported automated processes, MW microelectronics assemblies, System-in-Package (SiP) & heterogeneous integration. We also offer high level expertise in organic substrate design and manufacturing based on advanced materials, subtractive and mSAP processes.