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Positronics - Waste Plasma Gasification Process Technology
Plasma cracking is the latest technology for breaking the chemical bonds and destroy any kind of solid or liquid organic waste, PCBs (polychlorinated biphenyls), asbestos and hydrocarbons, some of which can be hazardous if disposed of in landfills or traditional mass-burn incinerators. Plasma gasification is a generic process which can accommodate virtually any waste material, including liquids gases and solids, in any form or combination. Moisture ...