S3 Instruments products

Single wafer processing clean heat treatment system. This system provides clean heat treatment in different atmospheres of vacuum, N2, H2 or other gases. It is also an automatic cassette-to-cassette processing unit, a perfect fit to annealing, alloying and other treatments of wafers after deposition.

Features: Reduces oxides in the solder by irradiating hydrogen radicals having strong reducing power generated in H2 plasma when heating and melting solder bumps in order to enable formation of pure bumps.

Feature: Provides quick heating and quick cooling processing works through direct heating by hot plate and special cooling mechanism so that optimal reflow conditions will be achieved. Reduces oxides of solder sheet and pad non-flux processing, with the whole stroke maintained in a H2 reduction atmosphere or anti-oxidation atmosphere to ensure excellent wettability. Eliminates voids by performing deaeration in vacuum during the process of solder melting.