Semikron Danfoss products

Trench IGBTs. Robust and soft freewheeling diodes in CAL technology. Highly reliable spring contacts for electrical connections. UL recognised file no. E63532.

SEMITRANS is a robust industry standard package with copper baseplate and screw terminals for the power connections. The SEMITRANS package features a low-inductance design and can be used for inverters from 20kW to 500kW. The modules are available for up to 900A and 1700V, achieved with different IGBT sources and SEMIKRON CAL diodes. With more than 25 years of market experience, the SEMITRANS package delivers a well-established tried and tested standard design.

SEMITRANS 10 is a robust industrial standard package with copper baseplate and screw terminals for the power connections. The SEMITRANS 10 package is a low-inductance design and is available in 1200V (1400A) and 1700V (1000A/1400A) half-bridge topologies as well as MLI in 1200V IGBT technology and 1200A nominal output current. High availability is ensured by the use of multiple IGBT sources and SEMIKRON CAL diodes.

The New High-Power Standard in Traction, Renewables and Drives SEMITRANS 20 represents the next generation standard power module for high-power applications. The SEMITRANS 20 product family features two different Versions: SEMITRANS 20 TRACTION: rolling stock reliability and SEMITRANS 20 INDUSTRIAL: optimised for wind, solar and drive applications. The SEMITRANS 20 is ideal for paralleling, allowing for scalable high-power inverter platforms and reducing the total cost of ownership.

The family concept of SEMiX includes a unification of IGBT and rectifier housings. All have the same height (17mm) and can be connected by one principal DC-link design, due to having the same interface for IGBT and rectifier stage. This saves development time and makes a simple and low-inductance DC-link profile possible. Spring or press-fit contacts allow for a gate driver mounted directly on top of the module. So there is no risk of noise on wires or loose connectors. With the flat package and separated AC and DC terminals a state-of-the-art inverter construction is possible, which is very compact. The auxiliary contacts avoid solder joints and offer highly reliable pressure contacts. This leads to an increased product reliability and lifetime.

In e-mobility applications reliability is the most important feature. Thanks to new thermal interface material with a 20% improvement in thermal resistance and AlCu-bonded diodes with higher current carrying capacity, the new SKiM-module can bring about an improvement of up to 23% with the same chip set and same lifetime or twice the power cycling capability in comparison to standard sinter modules!

he SEMITOP family is a 12-mm-height module family for the low and medium-power range, featuring a single mounting screw, without baseplate, and PCB interface via solder or press-fit pins. Low commutation inductance design and the use of the latest Si and SiC chip technologies make this product suitable for UPS and solar applications, motor drives, power supplies and welding equipment.

EMITOP E1/E2 is a 12-mm-high module platform with two lateral mounting screws, press-fit pins and no baseplate. SEMITOP E1 and E2 offer an alternative to the consolidated industry standard packages right down to chip level for supply chain security. The SEMITOP platform delivers enhanced module performance and the low-inductance case makes it possible to integrate the latest high-performance Si and SiC chips.