Technica, U.S.A.
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Technica, U.S.A. products

Micro Electronics

Heraeus - Microbond Assembly Materials

Heraeus` new SolderPro Series technology addresses today`s challenges in both processing and reliability. It offers wide processing windows, is specially formulated to address the soldering issues of nickel-based surfaces in air environments and offers complete compatibility among all fluxes used in the assembly process. These properties insure well formed joints that exhibit long term mechanical and electrical reliability. The SolderPro family of soldering solutions is available in all commercial alloys such as SAC305/405/0307, SnAg3.5.