Printed Circuit Boards (PCBs)
TJNE - Semiconductor Plating DSA System
The Semiconductor Plating DSA is a sophisticated plating system engineered for the semiconductor industry, focusing on applying precise layers of materials onto semiconductor substrates. This system leverages the principles of electroplating, using an electric current to deposit metal films with uniform thickness. It incorporates advanced digital switching technology and real-time current tuning to achieve consistent results crucial for high-density integrated circuits and packaging applications. With a modular design, the system can adapt to varying production capacities. Key components include a plating bath, power supply, and control unit, which collectively ensure meticulous control over plating parameters. The system's versatility supports wafer bumping, redistribution layer fabrication, and through-silicon via metallization. Thousands of installations worldwide affirm its reliability in meeting stringent demands of modern chipmakers, blending cutting-edge hardware with user-friendly interface for streamlined operations.
