UDM Systems, LLC products

Reduction of both electrostatic build up and sawdust surface contamination are essential in today`s die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors). The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.

For advanced applications, UDM provides the N2000_B, which offers the same superior features and performance of the N2000 but with a higher concentration. The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.

Reduction of both electrostatic build up and sawdust surface contamination are essential in today`s die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors).  The UDM Systems® L-Series lubricants are specifically design to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.

Reduction of both electrostatic build up and sawdust surface contamination are essential in today`s die separation of ultra-thin semiconductor materials (mobile communication ICs, CCDs and CMOS image sensors). The UDM Systems® L-Series lubricants are specifically designed to reduce electrostatic buildup, enhance lubrication, enabling sawdust dispersion and cleaner bonding pads.

Application: Diamond Wire Sawing Process: AKLC400 Coolant- lubricant is a biodegradable water based, non-caustic material. Dilution ratio of DI /RO water: Slicing Fluid is 500:1 to 1000:1. Effectively reduces the surface tension of cutting/slicing water solution to about 22.0 to 25.0 mN/m. Increases heat transfer (heat dissipation) therefore reducing thermal stress. Outstanding wetting and rinsing properties.

AKLC300 series detergent solution has excellent water softening properties, thus allowing the special blend of surfactants in the product to provide good detergency and emulsification. These properties are essential for rapid cleaning and complete sawdust (swarf) removal. Dilution ratio of DI/RO water:AKLC300 is 10:1 and 50:1.