25539 Datasheet

Americas Europe Asia Specialized Technology Resources, Inc. 24 Scitico Road PO BOX 813 Somers, CT 06071-0813 USA Phone: +1 860-763-7014 ext: 2560 Email: Susan.Wilson@STRSolar.com Specialized Technology Resources, España Parque Tecnologico de Asturias, parcela 36 33428 Llanera, Asturias SPAIN Phone: +34 985 73 23 33 Email: Raquel.Moran@STResp.com Specialized Technology Resources, Malaysia Plot 20, Jalan Tanjung A/3 Port of Tanjung Pelepas 81560 – Gelang Patah, Johor MALAYSIA Phone: +607 507 3185 ext:113 Email: Karen.Pong@STRSolar.com WWW.STRSOLAR.COM 2011-08 SRW Technical Data PHOTOCAP® 25539P Photocap® 25539P is a new thermoplastic encapsulant intended for thin film PV modules on the back-side of the device. Retention of glass adhesion and photo-thermal stability is comparable to other Photocap products. Photocap 25539P has lower moisture absorption and optical transmission relative to EVA based encapsulants. Photocap 25539P can be used for all crystalline silicon photovoltaic module constructions, and for many thin film photovoltaic designs. Photocap 25539P is provided as extruded rolled film ready for use in thermal lamination processes. The extruded product can be provided smooth, or with surface texture to improve vacuum lamination. Properties Test Method Units Condition Results ASTM Physical Mechanical Tensile Strength D638 MPa 23°C, 250 mm/min elongation rate 13 Ultimate Elongation D638 % 23°C, 250 mm/min elongation rate 400 10% Secant Modulus D638 MPa 23°C, 250 mm/min elongation rate 59 Hardness D2240 Shore A/D 23°C 60 / 20 Adhesion to Glass STR N/cm 23°C 80 Water Absorption D570 wt% 23°C < 0.01 Optical Optical Transmission E424 % 23°C, 0.46 mm thickness 0 UV Cutoff Wavelength E424 nm 23°C, 0.46 mm thickness 360 Refractive Index D542 - 23°C, 0.46 mm thickness 0 Electrical Volume Resistivity D257 ohm cm 23°C >1 x 1014 Dielectric Strength D149 kV/mm 23°C, 500V/sec 45 Dielectric Strength D149 V/mil 23°C, 500V/sec 1100 Tests are made in accordance with the current issue of the ASTM, or other cited test method. Test data reported here are nominal values measured on extruded films, 0.5 mm thick, or compression molded sheets and test bars, which have been cured at 150°C for 7 minutes with a laboratory press. PHOTOCAP® is a registered trademark of Specialized Technology Resources, Inc. The data set forth above is believed to be accurate. It is for informational purposes only and is not to be used for specification purposes. Neither Specialized Technology Resources, Inc., nor any of its affiliates, makes any representation or warranty as to, and disclaims all liability for, the information herein. PHOTOCAP is to be used by technically skilled persons at their own discretion and risk. WWW.STRSOLAR.COM 2011-08 SRW Technical Data page 2 PHOTOCAP® 25539P AGENCY APPROVALS: Modules that are properly constructed with Photocap 25539P have passed the requirements for performance specifications UL 1703, IEC 61215, and IEEE 1262. Photocap 25539P is UL listed with testing to 746D at all STR manufacturing plants. Please refer to UL file numbers E335471, E335472, E335473, and E335474. PROCESS GUIDELINES: Vacuum Lamination Step Heat Cure Cycle Nominal Temperature 165°C Platen Temperature 165°C Vacuum Range < 60 mbar Cure Time 6 min Evacuation Time 5 min Applied Bladder Pressure 910 mbar Target Temperature within the Encapsulant 130°C Time Above the Target Temperature > 1 min Values shown are a recommended starting point for a crystalline silicon photovoltaic module processed with a typical vacuum lamination system. Actual values required to achieve desired cure levels will depend on the specific PV module design and the lamination process used. All Photocap grades are based upon over 30 years of STR’s commercial experience in the photovoltaic market. For further information, please contact the nearest Specialized Technology Resources office or agent.