PC-cluster for EPL-PATACON

1 of 16Data Formats and Functions SupportedP20-5M12M-EPL-EPATACON PC-cluster for EPL is a for converting semiconductor mask CAD data to theEB data of masks for EB steppers. This software has several functions, for example pattern placementcorresponding to the structure of masks for EB steppers, complementary division for stencil masks, stitchingfor deforming the shape of a portion for connecting divided portions, proximity effect correction , machinecontrol data generation , and alignment mark insertion. This software operates in the environment in whichseveral to some hundreds of Linux PC's are connected by a high-speed network.PRELIMINARYNIPPON CONTROL SYSTEM CORPORATIONSample hardware configurationSample hardware configuration*1 Data format cannot be converted from MEBES to other EB data. *2 Under planning.Fracturing treatment- Mirror, rotate, scale- Boolean operation, resizing- Pattern fracturing- Small-figure treatment- Format conversion- Proximity effect correction- Extraction of aperture patternfor cell projection exposureEPL processing- Sub-field division- Complementary division- Stitching- Proximity effect correction- Alignment mark insertion- Exposure condition parameter outputInput data- GDS-II- OASIS(*2)- MEBES(*1)- MEBES mode5(*1)- JEOL52- JEOL52V1.1- JEOL52V2.1- JEOL52V3.0- JEOL52V3.1- HL-700- HL-800- (HL-900)- HL-7000- VSB11- VSB12- BEF(Advantest)Output data- GDS-II- OASIS(*2)- MEBES- MEBES mode5- JEOL52- JEOL52V1.1- JEOL52V2.1- JEOL52V3.0- JEOL52V3.1- HL-700- HL-800- (HL-900)- HL-7000- VSB11- VSB12- BEF(Advantest)2 of 161. EPL Data Conversion FlowPATACON PC-cluster for EPL is a system, which is based on PATACON PC-cluster andhas additional functions necessary for EB data creation for EPL masks. Data can be convertedfrom CAD data to mask writing data straightforward without creating an intermediate datafile such as GDS-II. In addition, data before correction for manufacturing a mask can alsobe output simultaneously for mask inspection. - Boolean operation- Resizing- Small-figure treatment- Data compression- Format conversion Alignment mark insertion Inspection datacreationNIKON plug-inComparativeverificationTreatment specific to EPLMask writing dataMaskinspection dataIntermediatedata Machinecontrol datacreationExposureconditionparameter data- Scale, mirror, rotate- Boolean operation, resizing- Division into sub-fields- Division into complementary mask- Stitching- Proximity effect correctionCAD data3 of 162. Features of EPL ProcessingSince masks for EPL have specific structures, the dedicated functions below are added to theconventional data conversion processing for photo-masks.- Division into sub-fields- Division into complementary masks- Stitching- Proximity effect correction- Alignment mark insertion- Exposure condition parameter output2.1 Division into sub-fields- Unnecessary division is avoided by using fuzzy boundaries.- Patterns are divided using the way to prevent fragmented patterns or long line patterns.2.2 Division into complementary masks- Doughnut pattern, long line pattern, leaf pattern, or large area pattern are detected and divided intotwo masks.- The pattern is divided at the apexes so that the number of patterns does not increase unnecessarily.- Adjoining patterns are assigned to two masks so that they are placed on different masks.grid 10umCourtesy by NEC Electronics CorporationEx. CPU / Gate Ex. L&S: DRAM / Gate4 of 162.3 Stitching- The shapes below are available as shapes for stitching.(1) Trapezoid (rectangle)(2) Triangle(3) Rectangularly approximated triangle(4) Convex/concave(5) Multi-stage convex/concave(6) Zipper- You can specify a shape of the additional pattern for each length of the divided edge.- Convex/concave patterns and zipper patterns can be overlapped by themselves.- Divided edges can be retreated for a trapezoid (rectangle) and triangle.- No additional pattern is added to the horizontally divided edge for a T or L-shape.Ex. Rectangle Ex. Rectangle Ex. Trapezoid Ex. TriangleEx. Multi-step triangle Ex. Convax/concave Ex. Multi-step Convax/concave Ex. T shape5 of 162.4 Proximity effect correction- Correction is performed by model-base pattern reshaping.- Two types below are available as the pattern reshaping method.(1) Bias type(2) Serif type- Bias type, which is simpler than the other type, is used for reducing processing time and output datasize.- Serif type is used for high-precision correction.- Correction is performed with considering influence from additional figures for stitching.+ Resize = 0.25-0.40nm- Resize = 0.50-2.75nmNumber of figures = 9- Resize = 0.50-0.75nmNumber of figures = 3Resize = +1.50-10.75nmNumber of figures = 7Resize = +1.75nmNumber of figures = 1Ex. Logic / Gate - Bias Ex. Logic / Gate - SerifEx. Contact hole - Bias Ex. Contact hole - Serif6 of 163. EPL Processing Parameters and Processing Flows3.1 Parameters and description of SF division parametersParameter Sample value (on the reticle)(1) Fuzzy boundaryFuzzy boundary 10.0 um3.2 Parameters and description of complementary divisionParameter Sample value (on the reticle)(1) Standard of small figures not to be dividedLong side of a circumscribing rectangle 10 um or less(2) Standard of long line figuresLength 20 um or moreRatio 1:20 or more(3) Standard of one-side supporting leavesMoment/width applied to the supporting part 160um2 or more(4) Standard of two-side supporting leavesMoment/width applied to the supporting part 40um2 or more(5) Standard of large aperture figuresAperture area 10000um2 or moreArea ratio to an adjoining rectangle 0.9 or more(6) Standard of sparse figuresLength of a long side of a circumscribing rectangle 20um or moreSize of a fuzzy boundary(1) Small patternif MAX(W,H) < N um,then not divide patternHWif MAX(W,H) > N um andMAX(W,H) / MIN(W,H) >= RATIO,then divide pattern(2) Long line patternWHif Area > N um2 and Area / (W/H) > RATIO,then divide pattern(5) Large area patternW(4) Leaf 21234567123456712345671234567123456712312312312121212341234123123123HWif Area*H/W > N um2,then divide pattern(6) Branch patternif MAX(W/H) > N um,then divide patternWHif Area*H/W > N um2,then divide pattern(3) Leaf 1123456789123456789123456789123456789123456789123456789HW-->-->-->-->-->H7 of 163.3 Parameters and description of stitchingParameter Sample value (on the wafer)(1) Trapezoid (rectangle)Distance from the edge to the upper base 20 nmDistance from the edge to the lower base 10 nmHeight 15 nmDent depth on a divided edge 0 nm(2) TriangleHeight 20 nmDent depth on a divided edge 0 nm(3) Rectangularly approximated triangleHeight 40 nmDent depth on a divided edge 0 nmNumber of stages 4(4) Convex/concaveDistance from the edge 20 nmHeight 15 nmOverlap width 5 nmOverlap height 5 nm(5) Multi-stage convex/concaveNumber of stages 3Overlap width 30 nmOverlap width 5 nmOverlap height 5 nm(6) ZipperDistance from the edge 20 nmHeight 15 nmWidth 20 nmOverlap width 5 nmOverlap height 5 nm(5) Multi-stage convex/concaveHeight and number of stages* Overlap width and heightOverlap heightOverlap width* Dent depth on a divided edgeDent depth(1) Trapezoid (rectangle)Distance from the edgeto the lower baseDistance from the edgeto the upper baseHeight(4) Convex/concaveDistance from the edgeHeight(2) TriangleHeight(3) Rectangularly approximated triangleHeight and number of stages(6) ZipperDistance from the edgeWidthA convex/concavepattern is repeatedfrom both the edgesof the sectionHeight8 of 163.4 Parameters and description of proximity effect correctionParameter Sample value (on the wafer)(1) CommonNumber of Gaussian curves 2Forward scattering diameter (ßf) 0.01umBack scattering diameter (ßb) 30.0umBack scattering coefficient (?) 0.4Reference range (x ßb) 3Writing threshold 0.4Energy differential allowance 0.0005Maximum number of repeated correction 2(2) Serif typeLength of the divided segment touching an apex 0.2umDivision count of the divided line touching an apex 1Minimum length of an intermediate division segment 1.0umMaximum length of an intermediate division segment 2.0umDivision count of an intermediate segment 3Standard value of segment movement smoothing 0.005um(1) Bias type(2) Serif type(1) Mesh energy calculation(2) Bias offset calculation(3) Pattern deformationbiasback scatteredenergy(1) Energy calculationfor each segmenta) Corner segmentation --> W-Edge length * N-Edge segmentsb) Mid segmentation --> W-Mid (MIN, MAX) * N-Mid segments(2) Smoothing(3) Pattern deformation12121212123123123average average9 of 164. Features of Mask FracturingMask fracturing converts CAD data into EB data for various mask writers. In addition, thisfunction can generate a new layer by applying Boolean operation to CAD data, and applycorrection to existing EB data, such as resizing, shrinking, and tone reversal.4.1 High-speed processingPATACON PC-cluster operates established PATACON mask fracturing software on a general-purposeLinux PC, and moreover operates several to some hundreds of Linux PC in a cluster environmentconnected by a high-speed network. Processing speed is almost proportional to the number of theLinux PC's by using the NCS's own parallel processing technology, which has been developed for longyears.4.2 Support of large-scale dataThis system can support CAD data and EB data for LSI whose scale of integration grow dramatically.Some hundred gigabytes of CAD data and EB data can be processed.4.3 Conversion emphasizing writing quality and high-speed writingWriting quality and writing speed are greatly influenced by the way of pattern decomposition in somewriting strategies of electron beam writer. This system aims at high-quality high-speed writing by makinga close technical collaboration with users. This system corresponds to the downsizing of mask patternsthat will progress increasingly and particularly emphasizes the small-figure treatment.- Small-figure treatment (JEOL52V1.0/V1.1/V3.0/V3.1, HL-700/800/900/7000,VSB11/12)In the data conversion phase, this system decomposes a CAD pattern into rectangles and trapezoidswriters can accept. As pattern sizes are reduced increasingly, the way for decomposing a patternand small-figures generated by pattern decomposition have an adverse impact upon writing quality.This system decomposes patterns so that the generation of a small-figure is minimized and writingquality is kept best even if a small-figure is by all means generated. This small-figure treatment isapplied not only to field boundaries but also field insides.4.4 Automatic data compaction and automatic library generationThis system compacts data automatically when outputting converted EB data. A library is automaticallygenerated not only for MEBES output but also JEOL52V1.0/V1.1/V3.0/V3.1 output, HL-700/800/900/7000 output and VSB11/12 output, so that data are automatically compacted without getting help fromsomeone.4.5 Extraction of aperture figures for cell projection exposureFor writers with a cell projection exposure function, this system is equipped with a function for extractingpatterns from pattern data, which are put on the aperture mask.10 of 164.6 Highly reliable pattern processingSince this system performs highly reliable processing for data including arbitrary angles and othercomplicated figures, you can use this system for mask manufacturing at ease.4.7 Plural job execution managementPATACON PC-cluster can execute more than one job simultaneously. In addition, the priority of eachjob can be changed or aborted even while a job is being executed.4.8 Graphic displayFor displaying input and output data, this system has a variety of display functions such as outline display,paint-out display, magnification/reduction display, display of overlaid layers, small-figure display, griddisplay, and line-width measurement with the cursor. It is the merit of these functions that extensivedata can be displayed rapidly.4.9 Counting up of operation recordThis system counts the number of jobs, processing time (entry, operation, and output), the number offigures, data volume, operating time, down time, and availability in the form of daily report, weekly report,and monthly report. In addition, this system can also count information on a specified job. You cangrasp operation status and get information for accounting by this function.4.10 User interface consistent with user operation formsThe specification of required user interface varies considerably according to the objectives of the systemuse and operation form. This system is equipped with standard window interface, however, NCSdevelops customized interface as well. In addition, NCS develops an automatic generation tool ofcommand files.- Window interface for specific users (special order for value)This service changes the parameter setup method of standard window interface according to therequests from users.- Command automatic generation program (special order for value)This program generates "command files" for making this system convert data from a user's CADdatabase or command files of the existing system.4.11 Plenty utility programsPlenty utility programs are available, for example data analysis tools for GDS-II, MEBES, JEOL52V1.0/V1.1/V3.0/V3.1, HL-700/800/900/7000 and VSB11/12.11 of 165. Commands and SubcommandsDedicated commands and subcommands are added to the command system of the conventionalmask fracturing to realize data conversion for EPL.5.1 Commands and subcommands for EPL processing(1) [.STEPPER], a data conversion command for the EB stepper, is addedSubcommands(a) AL mark pre-calculation specification ---------------------------------- CALMARK(b) AL mark dedicated conversion specification ------------------------- CONVMARK(c) AL mark reference specification (normal conversion) -------------- USEMARK(d) Input/output table specification ----------------------------------------- TBLNAME(e) SF offset specification ---------------------------------------------------- SFOFFSET(f) Complementary division specification --------------------------------- COMPTYPE(g) Stripe width specification ------------------------------------------------ STRWIDTH(h) Stripe height specification ----------------------------------------------- STRHIGHT(i) Stripe placement specification ------------------------------------------ PLACEMENT(j) Real stripe scope specification ------------------------------------------ CLIPPING(k) Applicable reticlet number specification ------------------------------- RETNO(l) Parameter file specification ---------------------------------------------- PRMFILE(m) Proximity effect correction for EB stepper --------------------------- EBPEC(n) Plug-in software support ------------------------------------------------- PLUGIN(o) Reticle size specification ------------------------------------------------- RETICLESIZE(p) AL mark pre-calculation by shapes specification --------------------- ALPAT(q) AL mark individual reference specification --------------------------- ALREF(r) EB exposure condition parameter output ----------------------------- EBPARAM(2) Subcommands have been added to the Boolean operation command [.OPERATE]Subcommands(a) Return post-Boolean operation table to layer table ------------------- MKLAYER(b) Format conversion with proximity effect correction for mask-writer --- PCONVERT5.2 Details of EPL processing commands and subcommandsFor details, refer to PATACON-EPL Command Specifications.12 of 165.3 List of main commands and subcommandsCommand Subcommand Function.INIT -------- Job initialization.DEFINE OUTTYPE Defines output format and detailed informationCHECK Defines input data checkingDefine parameters SIZE Defines a chip sizeGRID Defines grid processingMT Defines information on MTOPTION Defines option informationOVERLAP Defines the size of overlap in resizingDIVIDE Defines the division of the area to be processedCUTANGLE Defines the standard angle for the sharp tip cut in resizing.INPUT -------- Enters data.LAYER USE Defines the input data tableUSEF Defines the input data fileDefine the layer WINDOW Defines the area for processingto be used BLANK Defines the non-processed areaMOVE Moves the pattern dataROT Rotates the pattern dataMIRROR Reverses pattern data to a mirror imageARRAY Arrays the pattern dataMAG Magnifies/reduces the pattern dataMAIN Defines the main structureLAYNO Defines a layer number to be usedTLAYNO/FLAYNO Defines a specific layer number (text/pattern).OPERATE AND Calculates AND between layersOR Calculates OR between layersExecute data processing SUB Calculates SUB between layersNOT Calculates NOT between layersNOR Calculates NOR between layersNAND Calculates NAND between layersXOR Calculates XOR between layersRESIZE Resizes the layerCONVERT Converts the formatLFREE Frees the temporary layer tableTBLSIZE Checks whether the temporary layer table is blank or notLAYDISP Displays the layer* MKLAYER Returns a table after Boolean operation to a layer table* PCONVERT Converts the format (with PEC for mask writers).OUTPUT COMMENT Gives comments to output dataOUTTBL Defines the output table nameOutput HLCONDITION Defines the condition of conversion for HL in the output fileprocessing results SHOTRANK Adds shot rank information to JEOL52 outputPATTRD Defines JEOL52 V1.1 PREAD compatible outputSPPRM Defines the PATTRD parameterCONDITION Defines the conditions of conversion for JEOL52 V1.1 in the output file13 of 16Continued from the previous pageCommand Subcommand Function* .STEPPER * CALMARK AL mark pre-calculation specification* CONVMARK AL mark dedicated conversion specificationEPL conversion * USEMARK AL mark reference specification (normal conversion)* TBLNAME Input/output table specification* SFOFFSET SF offset specification* COMPTYPE Complementary division specification* STRWIDTH Stripe width specification* STRHIGHT Stripe height specification* PLACEMENT Stripe placement specification* CLIPPING Actual stripe area specification* RETNO Applicable reticlet number specification* PRMFILE Parameter file specification* EBPEC Proximity effect correction for EB stepper* PLUGIN Plug-in software support* RETICLESIZE Reticle size specification* ALPAT AL mark pre-calculation by shapes specification* ALREF AL mark individual reference specification* EBPARAM EB exposure condition parameter output.LIST -------- Outputs a table list.FREE -------- Frees the table.SEARCH -------- Searches pattern information.RESTART -------- Resumes processing after temporary suspension.CEND -------- Ends the command sentence.END -------- Ends the jobThe command specified with a * mark is a command and subcommand for the EPL processing.Available commands and subcommands vary according to the system configuration.Special commands (pseudo-commands);@MKFRAME Adds frame data for negative resizing;@STARTDIV, ;@ENDDIV Divides the chip;@CHECKON, ;@CHECHOFF Turns on/off syntax checking temporarilyCommands for the job execution program%LD Reads a command file to execute it%ON_ERROR_GOTO Jumps when an error occurs%GOTO Jump%END Finishes executing a command file%LG Specifies a default log file name Executes a UNIX command14 of 166. Operation EnvironmentThis software operates in a cluster environment, in which several to some hundreds of LinuxPC's are connected by a high-speed network. Processing speed is almost proportional tothe number of the Linux PC's by using the NCS's own parallel processing technology, whichhas been developed and improved for long years.- Linux PC configurationSince the license fee of the software is determined according to the number of CPU's used, it isrecommended to use high performance latest hardware. For details, contact our company.Sample large-scale configurationSample small-scale configuration Sample medium-scale configurationClient Client??·???Client Client1st LAN2nd LAN (Gigabit)ClientServerClient1st LAN2nd LAN (Gigabit)2nd LAN (Gigabit) 2nd LAN (Gigabit)Sub-server Sub-serverServerClient Client2nd LAN (Gigabit)Sub-server1st LANClient Client2nd LAN (Gigabit)Server- Server: Manages the whole system, prepares/distributes entry data, and coordinates output data- Client: Converts assigned data- Server: Manages the whole system, prepares/distributes entry data, and coordinates output data- Sub-server: Distributes entry data- Client: Converts assigned data15 of 167. Software License and Sales Form7.1 Software license feeThe license fee of the software is determined according to the number of CPU's used. For details,contact our company.7.2 Sales/maintenance stylesSales/maintenance style 1: software + hardware (configured with the commercial PC servers NCSrecommends)- The hardware NCS recommends is adopted and delivered as a system with the software installed.- The software and hardware are guaranteed and maintained together.- NCS always keeps hardware spare parts available in the office.Sales/maintenance style 2: software + hardware (configured with the products you specify)- The hardware you specify is adopted and delivered as a system with the software installed.- The hardware is delivered as resale.- NCS guarantees and maintains the software only. For the maintenance of the hardware, contact thehardware manufacturer directly.Sales/maintenance style 3: software only- NCS sells the software only.- The software is installed in the hardware you prepare.- The software is installed for value.- NCS guarantees and maintains the software only. For the maintenance of the hardware, contact thehardware manufacturer directly.16 of 16System specifications are subject to change without notice for improvement.Development and sale: Nippon Control System Corporation- Head Office:1-19-15 Ebisu, Shibuya-ku, Tokyo, 150-0013, Japantel: +81-3-3443-5081 fax: +81-3-3443-5189- Shin-Yokohama Office:2-7-9 Shin-Yokohama, Kouhoku-ku, Yokohama-shi, Kanagawa, 222-0033, Japantel: +81-45-477-5800 fax: +81-45-477-5811For this product, please contact the Shin-Yokohama Office.Email: horiuchi@nippon-control-system.co.jpContent of this catalog: as of April, 2004 P20-5M12M-EPL-E