PV Silicon Wafering Process Specification

Monocrystalline Ingot Squaring High-Performance Specialty Products Two-component temporary bond-ing adhesives designed specifically for squaring of monocrystalline or multicrystalline ingots.Unique composite polymeric resin designed to self-dress the saw blade with each slice. Wire saw mountable, eliminating the need for glass and other substrates. Epoxy Adhesives - Polymer Mounting Beams - Formulated DetergentsVALTRON AD4000 Heat Release Epoxy SystemVALTRON Photovoltaic Slicing BeamComposite polymer mounting beam for PV wafer processing, especially diamond wire slicing. Unique surface texture promotes improved adhesive bonding and dimensional stability. Two-component fast-curing epoxy system for adhering PV ingots for slurry slicing applications.Two-component medium viscosity epoxy system for adhering PV ingots for diamond wire slicing applications.Ingot Mounting for WaferingVALTRON Ingot Mounting PlateVALTRON AD1339-A / AD3905-B Quick-Cure Ingot Mounting Adhesive VALTRON AD1846-A / AD1846-B Medium Viscosity Quick-Cure Ingot Mounting Adhesive See back page for formulated detergents.www.valtechcorp.comMonocrystalline silicon ingot bricks easily debonded from adhesive and mounting fixture after squaring when heat is applied. VALTRON ingot mounting adhesive applied to PV slicing beam for wafer slicing.Sliced wafers ready for debonding.AD4000 Series Epoxy Adhesive High purity, low foam alkaline detergent which exhibits excellent cleaning and rinsability.Wafer Demounting & Cleaning Post Slice Cleaning VALTRON DP146 Low Foam Alkaline Detergent VALTRON SP2260 Alkaline Detergent De-Bonding VALTRON DP164 Adhesive De-Bonding & Cleaning Solution for PV WafersPre-Cleaning VALTRON DP146 Low Foam Alkaline Detergent VALTRON SP2260 Alkaline Detergent Final CleaningVALTRON DP184 Alkaline Detergent for PV Wafer CleaningVALTRON DP187 Low Foam Alkaline Detergent for Final PV Wafer CleaningVALTRON SP2260 Alkaline Detergent Formulated for fast and effective penetration and removal of contaminants. Formulated for adhesive de-bonding and preliminary cleaning of PV wafers. General purpose detergent for effective cleaning leaving no organic or inorganic residue. Formulated for fast and effective penetration and removal of contaminants. Effectively cleans and removes silicon kerf, cutting slurry and abrasives by-products of diamond wire and silicon carbide slicing. Low foam alkaline detergent formulated for final PV wafer cleaning and removal of contaminants normally resistant to conventional detergents.Formulated for fast and effective penetration and removal of contaminants. 2113 Sanatoga Station Road, Pottstown, PA 19464 USAP: 610-705-5900 • F: 610-705-0300For technical service call or e-mail: technicalservices@valtechcorp.comwww.valtechcorp.com CERTIFIEDISO 9001 : 2008REACH EC 1907/2007TB-PVSiliconWaferingProcess, Rev. B, 6/11/2012is a registered trademark of Valtech CorporationWafers de-bonded from PV slicing beam using a solution of hot water and VALTRON detergent.Ultrasonic cleaning of wafers using VALTRON detergent.In-Line cleaning of wafers using VALTRON detergent.Information herein is accurate to the best of our knowledge. Suggestions are made without warranty or guarantee of results. Before using, user should determine the suitability of the product for its intended use and user assumes the risk and liability in connection therewith. We do not suggest violation of any existing patents or give permission to practice any patented invention without a license.