TIMARIS - Multi Target-Module (MTM) - Brochure

Multi-Target-Module with 10 DC/RF CathodesMultiple film stack deposition, without the need to break ultra-high vacuum, is one of the key advantages of the MTM process module. Additional features such as wafer heating for hot substrate deposition (option) or a collinear Aligning Magnetic Field (AMF) are available. The AMF can be activated to align the magnetic easy axis during deposition of ferromagnetic films.The Linear Dynamic Deposition (LDD) technology enables the capability to deposit wedge films with a different film thickness across the wafer and to deposit alloy films with adjustable concentration gradients across one wafer. Both features allow a very cost effective development of film stacks and accelerate the devices development. The LDD technology is the key to delivering world class material uniformity across large wafers and exceptional precise control of ultrathin layer thickness down to 1 % of a nanometer.