
3M

3M - Model A153L - 4.25 inch Diamond Pad Conditioner for Semiconductor
From3M
Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership. Optimized for extended pad and disk life. Diamonds secured with both chemical and mechanical bonds for superior retention.Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for superior diamond retention, with controlled diamond placement and protrusion.
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Abrasive Material: Nickel based alloy with patterned diamond
Abrasive Working Surface: Full Face
Aggressiveness: 6-9
Applications: CMP
Carrier Color: Gray
Carrier Format: Disk - with bevel edge
Carrier Size: 4.25 inch diameter
Carrier Substrate: 304 SS
CMP Process: Cu (barrier), Final Buff, STI Process, W (buff)
Diamond Size: 151 um
Diamond Type: Type 3, semi blocky
Manufacturing Location: United States
Product Series: A153L
Product Type: Diamond Pad Conditioner