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Advint Incorporated
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  5. Advint - Model PRC Pulse - Reverse ...

Advint - Model PRC Pulse -Reverse Current Plating Rectifier

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Pulse periodic reverse current plating builds on the pulse plating concept by incorporating brief periods of reverse current during the plating cycle. This approach offers greater control over the deposition process.

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Is Pulse or Pulse Reverse Current Plating the Right Solution?

If you`re facing any of these challenges, pulse or pulse reverse plating could be the answer you`ve been searching for:

  • Inconsistent coating quality or thickness
  • Difficulty plating complex geometries
  • High rejection rates due to poor adhesion or appearance
  • Excessive material waste or energy consumption
  • Need for improved wear resistance or corrosion protection
  • Desire to reduce or eliminate toxic additives in your plating process
Understanding Pulse and Pulse Reverse Plating

To fully appreciate the power of these technologies, let`s delve into the principles behind pulse and pulse reverse plating:

  • Mass Transport Control: By pulsing the current, we create favorable concentration gradients near the cathode surface, allowing for higher deposition rates and improved deposit quality.
  • Nucleation and Growth: Short, high-current pulses promote the formation of many small nuclei, leading to finer grain structures and enhanced material properties.
  • Double Layer Effects: Pulse plating can manipulate the electrical double layer at the electrode-electrolyte interface, influencing adsorption processes and deposit characteristics.
  • Selective Dissolution: In pulse reverse plating, brief reverse current periods can selectively remove fewer stable deposits, improving overall coating quality and leveling.
Choosing the Right Equipment

To harness the full potential of pulse and pulse reverse plating, you need a reliable, high-performance rectifier. Look for these key features when selecting your equipment:

  • Precise waveform control for optimal results
  • High frequency capability (up to 10 kHz or more) to handle advanced applications
  • User-friendly interface for easy parameter adjustment
  • Data logging and process monitoring capabilities for quality control
  • Robust design built to withstand industrial environments

  • Exceptional Leveling: Achieve ultra-smooth surfaces, even on rough substrates.
  • Superior Distribution: Plate uniformly across complex shapes and high aspect ratio features.
  • Precise Alloy Composition Control: Fine-tune the properties of multi-metal deposits.
  • Reduced Dendrite Formation: Minimize unwanted growth and improve deposit quality.
  • Optimized Additive Performance: Enhance the effects of brighteners and other plating additives.