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ULVAC GmbH
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Model RISE-300 - Batch System To Remove Native Oxide

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Batch type equipment of chemical dry cleaning for remoral of native oxide in Narrow and Deep-contact patterns of advanced semiconductor.

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plasma etching system
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plasma process
  • Damage-free (remote plasma and low-temperature process)
  • High throughput and low CoO
  • Processing in batches of fifty wafers
  • Superior uniformity of etching (5% or less per batch)
  • Easy maintenance (no side maintenance access is required)
  • Small foot print compare to cluster type equipment
  • 50% lower self-aligned contact resistance compared to current wet process
  • The Smallest foot print

  • Pre-cleaning for self-aligned contact (SAC) formation
  • Pre-cleaning for capacitor formation
  • Pre-cleaning for epitaxial growth
  • Pre-cleaning for Co or Ni salicide