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Plasma Etch - Model PE-100 -Benchtop Plasma System
The PE-100 is a complete plasma treatment solution capable of reactive ion etching, plasma functionalization, and more. This model is perfect for manufacturers, medical facilities, universities, research facilities, or any other company in need of a cost-effective, production-grade plasma processing solution.
The convenient chamber size, along with the availability of high frequency RF power, combine to create a production capable unit small enough to fit nearly anywhere in your lab or production work space.
Full laptop control enables enhanced consistency and complexity of recipes. PC automation also provides ease of use on the production floor.
This model is available in one of three standard configurations:
- Plasma Cleaning/Plasma Etching
- Reactive Ion Etching (RIE)
- Convertible Configuration - Includes both isotropic and anisotropic plasma processing in a single system. Removable tray configuration.
- Electrode Configuration : Three Stacked Horizontal (9"Wx13"D + 3" Clearance) (Several optional configurations available)
- Generator : 300W 100KHz Continuously Variable Power Supply
- Control System : A laptop loaded with Plasma Etch, Inc. software is included for fully automatic system operation, process sequencing, multiple recipe storage, and other advanced features
- Gas Control : One 0-50cc Mass Flow Controller
- Vacuum Gauge : 1-2000 mT
- Vacuum Pump : 8CFM 2-Stage Direct Drive Oil Pump with Oil Mist Coalescing Filter (Oxygen Service – Krytox Charged)
- Chamber Material : 6061-T6 Aluminum
- Chamber Dimensions : 12”x14.5”x12”
- Unit Dimensions : 17"x28"x30"
- Unit Weight : 160lbs
- Vacuum Pump Weight : 68lbs
Most systems can be customized with a wide range of options including:
- Custom Sized Vacuum Chamber, Number/Size of Electrodes : To ensure your system is able to specifically meet your throughput requirements
- Reactive Ion Electrodes : Enables reactive ion etching
- MHz Power Supplies with Automatic Matching Network : Higher watt/frequency power supplies
- PC-based Control System : For fully automatic system control, multi-step process sequencing, multiple recipe storage, data logging/trending, events/alarms, etc.
- Electrostatic Shielding : Significantly increases process uniformity by eliminating excess etching at the outer bounds of the processed material
- Temperature Control System : To maintain specific temperatures in the processing chamber for enhanced uniformity and application-specific needs
- Dry Vacuum Pump : For more control over the process chamber pressure
- Chamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas Generator : To ensure thorough removal of contaminants from operating equipment, providing uniformity and increasing longevity
- Vacuum Pump Oil Mist Eliminator : Captures oil from vacuum pump exhaust
- Vacuum Pump Oil Filtration : Filters the vacuum pump oil down to a 3 micron level, increasing the longevity of the oil and the vacuum pump
- Automatic Vacuum Control : Provides automation of the process chamber pressure
- Additional Digital Mass Flow Controllers : Provides digital automation and monitoring of process gases
- Software Configurable Gas Steering Matrix : Designed to allow for up to 5 process gas inputs with 3 selectable at any time
- Low Gas-Source Alarm : Notification for when your process gas container needs replenished
- Light Tower : For easy visualization of the steps of the plasma processing sequence
- Fume Scrubber : To eliminate hazardous fumes/contaminants from the chamber/vacuum pump exhaust
- Electrical : 120VAC / 60Hz @ 15A or 220VAC / 50Hz @ 14A
- Compressed Air Service : 80-100PSI, 0.5CFM
- Regulated Process Gases : 15PSI, 2-Stage Regulator