Regardless of the market, the same applications have ever-increasing cooling requirements.
Batteries
Advancements in battery chemistry combined with demanding user needs such as fast charging are resulting in battery packs becoming increasingly difficult to thermally manage.
Electronic Components
New technologies and packaging requirements are resulting in smaller and smaller electronics that produce more and more heat.
Embedded Processors
As vehicles become software defined processors designed for data centers are now required in harsher environments such as defence, aeronautics and passenger vehicles.
Personal Computers
Computers are well established as critical tools to enable modern-day work, they must be ultra-reliable with zero-maintenance and traditional cooling methods have reached their limits.
Power Electronics
Advancements in nano-technology (including GaN & SiC) are creating components with ever increasing heat density, combine this with the need to reduce packaging weight and volume and power electronics are increasingly difficult to thermally manage.
Servers
Advancements in nanometer lithography combined with demanding workloads from AI are resulting in computer processors that are producing more waste heat at an increased density.