EBARA Precision Machinery Europe GmbH (EPME)

EBARAModel F-REX300X - CMP Tool

SHARE

The F-REX300X polishes 300 mm wafers. With four platens and a layout for different parallel and serial polishing modes to target Cu and other advanced applications.

Most popular related searches
  • High process performance
  • High volume manufacturing
  • Energy saving design concept
  • Customer specific options
  • High reliability
  • Experience in CMP since 1992
  • Oxide
  • ILD (Interlevel Dielectric)
  • STI (Shallow Trench Isolation)
  • Tungsten
  • Copper for IC Fabrication
  • MEMS
  • SOI (Silicon On Insulator)
  • Magnetic Media