EBARA Precision Machinery Europe GmbH (EPME)
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- EBARA - Model F-REX300X - CMP Tool
EBARA - Model F-REX300X - CMP Tool
The F-REX300X polishes 300 mm wafers. With four platens and a layout for different parallel and serial polishing modes to target Cu and other advanced applications.
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- High process performance
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- Experience in CMP since 1992
- Oxide
- ILD (Interlevel Dielectric)
- STI (Shallow Trench Isolation)
- Tungsten
- Copper for IC Fabrication
- MEMS
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