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Daitron - Model WBM -High-Performance Wafer Bevel Machine
Daitron is your source for premium wafer bevels. As a trusted electronic component and capital equipment global distributor, we are dedicated to providing the best customer service with competitive pricing. We work with a broad spectrum of industries, supplying wafer edge grinder for various applications, including semiconductors, solar cells, electronics, heavy-duty industrial, transportation, medical and biomedical, fiberoptic, and more. With decades of experience, the team at Daitron is committed to providing high-quality wafer bevels that meet customers` demands. Trust Daitron to supply your industry-leading products.
- This wafer edge grinder machine is designed to form an edge bevel on 2 inch to 8 inch diameter wafers.
- The range of materials that can be processed includes silicon and many other semiconductive substrates.
- This model replaces the well-established DE(N)P series.
We also make a ground-breaking chamfering system that can form a trapezoid or radius shape on the edge of an AS-slice wafer using the same resin-bonded wheel.
- Compact Design - 50% less foot print area compared to existing model DENP-250A and competitors
- High Accuracy - By utilizing one-piece cast iron frame, the vibration during grinding was better controlled and damage on wafer edge, which minimizes chipping.
- High Machine Stiffness - To obtain higher stiffness of the spindle unit, Z axis movement from spindle was eliminated.
- OF Linearity Improved by 33% - OF linearity specification has been improved from 15um to 10um. By consolidating X-Y- θ -Z unit into one unit, instead of having two separate moving units, OF linearity specification has been improved.
- Easy Maintenance - Improved accessibility to all internal mechanisms and controls makes the WBM-2000 easier to maintain. Grinding wheel change can be accomplished with convenient access from the side. The result is higher productivity with less downtime.
- Easy Operation - Operator control using LCD touch panel and easy to understand menu screens.
- High Efficiency - Max 163 wfrs / hr with max speed of 22 sec / wfr. (15 sec / wfr using dual axis model) with wafer exchange time of 10 sec / wfr (WBM-2200)
- Motor used for Grinding Y axis and Grinding Z axis were converted from stepping motor to AC servomotor for higher precision.
- Mechanical layout of the machine was also renewed.
- Wafer Transfer unit is relocated to center of both grinding stations to minimize the transfer distance.
