Dissipator - Model 745 -Thermally Conductive Room Temperature Cure Adhesive

Dissipator 745 is a thermally conductive room temperature cure adhesive that is designed for bonding electrical components to heat sink with a controlled gap. Dissipator 745, through a special shimming property, insulates the component electrically while allowing thermal conductivity. This special shimming feature produces a constant gap of 0.005 in. to 0.006 in. between components.