SEMCO Technologies

SEMCOElectrostatic Chucks

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Electrostatic chucks and smart clamping solutions for thin and ultra-thin wafers.

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SEMCO Technologies has been designing and manufacturing in France innovative electrostatic chucks (ESC) and heating pedestals for the wafer processing industry since 1992.

SEMCO Technologies provides leading OEMs, Semiconductor Fabs, foundries and laboratories worldwide, directly, or through SEMCO Technologies subsidiaries and service centers.

Technical caracteristics

Safe and easy handling of semiconductor wafers, flat panel displays, solar cells, and other substrates. Clamping capability of a variety of materials including dielectrics and compounds.

Size
Compatible with substrates from 50-mm to 450-mm diameter.

Process Temperature
Wide operating temperature range between -150°C (-238°F) and +650°C (+1200°F).

Coulombic based technology
For Si and III-V wafers, compatible with non conductive substrates sus as Sapphire, TSV carriers...

Electrode Type
Bi-Polar, Multi-Polar

Wafer Contact Surface
Custom Pattern dedicated to customer`s applications