ETSP Co., Ltd.
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ETSP - Model TO Series -Industrial Oven
FromETSP Co., Ltd.
ETSP-TO series are industrial batch process ovens for product evaluation and testing in semiconductors, electronics, plastics, chemicals, pharmaceutical areas for curing, drying, sterilizing, aging, heat treating and other production applications. Solved temperature variations, unbalanced air distribution inside the oven.
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- Friendly, flexible, up-to date control and management systems.
- 304 stainless steel interior with carbon blower and plated hardware.
- Pressure gauge to indicate interior oven pressure.
- Horizontal air flow assures uniform thermal performance under all loading conditions.
- Adjustable flow rate: Purge inert flow rates (20~200 SCFH) / Main tain inert flow rates (10~100 SCFH)
- Allows easy servicing and upgrades.
- Water cooling unit is included for the cool down stage or for operating at lower temperatures.
- Computer control is available.
- Network connection of several chambers to a single "master" control unit allowing centralized supervision both in local and remote mode.
- Temperature range: RT ~ 350 °C (changeable according to user’s demand)
- Temperature stability: Less than ± 0.5 °C
- Temperature uniformity: Less than ±3.0 °C at 350 °C
- Heat-up rate: More than 6°C/min
- Input power requirements: 230V ±10%, 380V ±10%, 50Hz/60Hz, 1Ph/3Ph
- 2 shelves
- End of cycle, Hi&low limit audible alarm
- Caster for moving
- Real time clock (Auto start)
- Chart recorder
- RS232/485 oven networking with control system
- Door lock system (including door switch)
- Port hole and rubber plug
- T/C (Thermal couple) data acquisition (8, 16, 24, 32 Ch)
- Customization available