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Forge Nano - Model THEIA - R&D Scale Wafer Coating System
THEIA combines the production-proven design and system components of our commercial solution, APOLLO, in an R&D package that delivers unmatched performance, flexibility, reliability, and safety. THEIA is field upgradeable to accommodate the ever-changing needs of scientists and engineers, enabling a seamless transition from R&D to production. Recipes created with THEIA can be sent to APOLLO for a simple and straightforward path to commercial scale production of semiconductor wafer coating.
THEIA delivers ultra fast deposition with Forge Nano’s patented SMFD-ALD™ in a low cost system for R&D budgets. Sub-second ALD cycle times allow efficient and rapid exploration of applications requiring thick films. Covering challenging patterned substrates such as advanced-generation DRAM device wafers, membranes, sensors, electron multipliers, etc. with aspect ratios up to 1,000.
THEIA is a low-cost and versatile ALD system that fits most R&D budgets. The flexible chamber design allows for both; round up to 200 mm substrate chuck that fits semiconductor wafers, or square parts carrying tray that better accommodates panels or randomly shaped parts.
- Fast and thick film deposition ( > 5 micron)
- Fast ALD deposition at low temperatures
- Low temperature processing (down to 80 °C)
- Seamless incorporation of nano-laminates with reproducible atomic-layer control
- Composite ternary and quaternary alloy films with no throughput penalty
- In situ QCM monitoring of film growth with high mass and time resolution
- Field reconfigurable
Temperature Window: 50 – 500 °C
Liquid Chemical Inlets: Up to 6
Gaseous Chemical Inlets: Up to 4
Footprint: 60″ L x 32″ W x 76″ H
Capacity: Up to 200mm wafers
5mm height clearance for coupons and objects
Substrate Handling: Manual single wafer loading