Yamato Scientific America Inc.

301 - Gas Plasma Reactor

Standard barrel type low temperature ashing devices suitable for a wide range of application such as ashing , etching and dry cleaning.

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Isotropy barrel type
Compact, space saving design
Capable of removing coated organic matter
Adjustable RF suitable for various applications
Outstanding operability and safety
Can be set for a wide range of output conditions to handle a variety of testing samples

Functionalization of the polymeric material surface improves adhesion
Oxidation reaction generates functional groups -OH, >C=O, -COOH on the surface (very small amount of water and carbon dioxide will impact)
In nitrogen plasma, a nitrogen atom is incorporated onto the surface, generates a functional group -NH₂ Resist peeling
Surface modification of materials (metals, polymers, films, ceramics, etc.)
Asbestos pre-processing (ashing of membrane filter)
Low-temperature ashing (polymer material, coal, food, etc.) PDMS chips bonding to glass and PDMS substrate
Production of semiconductors and analysis work

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