Hi-MO 5

Uniform smart soldering increases the power and efficiency of the module, and improves the power load capacity.

Large-format modules with M10 wafer size use dual-glass and frame packaging to ensure module strength.

Smart module packaging solutions are used to achieve high reliability, low-cost transportation and logistics.

The working current is about 13A, which is perfectly adapted to mainstream string inverters.

Gallium-doped technology overcomes LID degradation and guarantees the long-term power generation of the module.

Additional power generation from the backside of bifacial modules increases the overall energy yield, which has been verified by customers and third-party testing organizations.