- Home
- Companies
- Technica, U.S.A.
- Products
- Heraeus - Model SolderPro Series - ...
Heraeus - Model SolderPro Series - Microbond Assembly Materials
Heraeus` new SolderPro Series technology addresses today`s challenges in both processing and reliability. It offers wide processing windows, is specially formulated to address the soldering issues of nickel-based surfaces in air environments and offers complete compatibility among all fluxes used in the assembly process. These properties insure well formed joints that exhibit long term mechanical and electrical reliability. The SolderPro family of soldering solutions is available in all commercial alloys such as SAC305/405/0307, SnAg3.5.
The Heraeus SolderPro Series offers a family of products to suit all soldering process needs, including
- The SolderPro Series F640SAC for printing
- The SolderPro Series F640SAC for dispensing
- The SolderPro Series SF64 flux for rework
- The SolderPro Series W640SAC wire for rework and special applications
Many lead frame and passive components are migrating to final finishes that use nickel as a barrier layer and plate Sn, Pd, Au or PdAu on top of it. Small imperfections in the plating expose the nickel and impair its solderability. The SolderPro Series F64* family is formulated with a special activator mixture that ensures good wetting to partially oxidized nickel surfaces, providing higher yields and less rework than competitive products. The flux package is capable of completely removing all existing oxidation on difficult-to-wet surfaces, even in air reflow environments.