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Model CM 74 -Grinding Standard Chamfered Edges On Multi-Crystalline Silicon Ingots
Capable of grinding standard chamfered edges on multi-crystalline silicon ingots, the CM74 is aimed at high volume manufacture and is a perfect complement for the TS2 Surface Grinding machine in a cellular manufacturing environment. The machine addresses the need for superior surface finish on chamfers by utilising multiple spindles to grind all four chamfers simultaneously thus allowing for a substantially slower linear in feed rate. The CM74 retains the ability to operate within an automated production environment and includes a handling interface for component exchange with a factory automation system.
- Four Spindle Simultaneous Grinding for reduced cycle time
- Low cutting forces result in reduced sub-surface damage for improved wafer yield
- Full CNC control system for ultimate machine flexibility
- Optional Laser measuring system for in-process component inspection
- Cost effective solution for high capacity when utilised with Abwood TS2 Surface Grinding Machine
By using four grinding spindles simultaneously, the CM74 is able to grind chamfer edges at a reduced linear feedrate. In addition to this, the use of high frequency spindles combined with ultra fine diamond grinding wheels results in superior surface finish and reduced sub-surface damage thus maximising potential wafer yield.
- Workpiece Material: Multi Crystalline Silicon
- Work Process: Chamfering
- Maximum Workpiece Dimensions: 210mm x 210mm x 250mm
- Minimum Workpiece Dimensions: 125mm x 125mm x 150mm
- Machine Dimensions: 2000mm x 1200mm x 2000mm
- Machine Weight: Approx. 2000kg
- Connection Capacity: 6 kW
- Voltage/Frequency: 400V/50Hz; 480V/60Hz
- Compressed Air Requirement: 5-7 bar
- Coolant: Water
- Approximate Capacity: 195MW