Osaka Gas Chemicals Co., Ltd.

Model SI-30 series -Resin additives grade OGSOL

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This series is a low molecular weight type that consists of a unitary structure of a five-membered ring. You can use this series as an additive for enhancing water repellency and lubricity of resin or as a reaction intermediate. Although this compound is a silicon based material, it causes less segregation on the resin surface.