Model TS 207 Series - Inner Diameter Saw
From Competences- Cutting / Slicing -PV Mono -Cropping
Best cutting quality WITH minimum kerf loss for PV and semiconductor industrIES. Our inner diameter saw TS 207 combines best cutting quality with minimum kerf loss. Robust construction and easy handling are additional features of the TS 207. The machine is loaded manually with silicon ingots or bricks and offers flexibility of use.
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Benefits
- High capacity
- Monocrystalline silicon ingots or bricks
- Flexible use
- High surface and cutting quality
- Lowest kerf loss
- Lowest Cost of Ownership
Orientable crystal axis
For processing monocristalline silicon the TS 207 is available in two versions (series 8 and 13). The series 8 allows users to orient the crystal axis to the blade prior to cutting. Due to this, wafers can be cut perfectly parallel to the crystal lattice. This complies with highest demands of the semiconductor industry.
Application |
Semi + PV |
PV |
|
Material |
Mono Si |
Mono Si |
|
Cross sections |
ø 100 - 215 mm |
ø 150 - 215 mm / ø 125 mm / ø 156 mm |
|
Block length |
82 - 2100 mm |
300 - 2850 mm |
|
Brick length |
50 - 760 mm |
120 - 1000 mm |
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Crystal axis orientation |
Yes |
No |
|
Operation modes |
Manual |
Semi/Full automatic |
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