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MuhlbauerModel MCL -Flexible LED Luminaires

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  • NEW: ALL IN ONE production solution
  • Adhesive apply (either jetter via dispenser or printing)
  • Conductive glue (such as ACP or ICP) or solder paste
  • Flip chip (CSP) LED or SMD package LED attach
  • SMD component assembly, i.e. electronics, sensors, connectors, batteries, lenses or RFID
  • Placement accuracy of +/- 50µm
  • In line curing (thermodes or reflow oven)
  • Glop top unit for encapsulation
  • Integrated test station
  • Output slitting (optional)
  • Wind up with support of spacer tape
  • Throughput: Up to 15,000 / 40,000 UPH