Vertiv Group Corp.
Vertiv - Model PowerDirect - Rack 33kW 50V DC Power System
The PowerDirect Rack 33kW 50V DC Power System is a high-density, scalable DC power system designed for modern data centers and Open Compute ORV3 environments. This modular system offers up to 132 kW per rack with high-efficiency power supply units (PSUs). The flexible design allows live addition of power shelves and PSUs for seamlessly expansion as power needs increase. It has a power management module (PMM) that optimizes power distribution and monitoring of up to 48 PSUs. Ideal for high-capacity server setups, it maximizes power efficiency and minimizes space requirements.
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- HIGH POWER DENSITY: It delivers 33kW (660A at 50V DC) per 1U shelf, maximizing rack space for high-density AI, cloud, and hyperscale computing.
- SEAMLESS SCALABILITY: It supports hot-pluggable expansion, allowing additional power shelves and PSUs without disrupting live operations.
- HIGH EFFICIENCY: It operates at 97.5% peak efficiency, reducing total heat loss and power consumption for lower operational costs.
- ORV3 HPR COMPLIANT: It is optimized for ORV3 High Power Rack (HPR) compliance that allows seamless integration into Open Compute infrastructure.
- FLEXIBLE POWER INPUT RANGE: It supports both AC and HVDC input, which enables versatile deployment across different power architectures with the same power system.
- REDUNDANT POWER CONFIGURATION: It enables N+1 and N+N redundancy setups for continuous power availability.
- UNIVERSAL POWER COMPATIBILITY: It supports 200-277V AC single-phase, 200-480V AC three-phase, and 240-336V DC power input for global deployment flexibility.
- INTELLIGENT POWER MANAGEMENT: It works seamlessly with the Vertiv Power Management Module (PMM) to enable real-time telemetry, load balancing, and remote monitoring.
- OPTIMIZED FOR HIGH-CAPACITY SERVERS: It powers high-performance GPUs, CPUs, and AI clusters from Nvidia, AMD, Intel, and other leading hardware providers.
- COMPACT & LIGHTWEIGHT: Weighing only 11.1 kg per shelf, it maximizes rack space efficiency while maintaining a low-profile form factor.