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UVFAB Systems, Inc.
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  5. UVFAB - Model 224 Series - Manual Wafer ...

UVFAB - Model 224 Series -Manual Wafer Mounting Systems

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The manual wafer mounting systems offered by UVFAB Systems, Inc. are versatile solutions for mounting wafers in various applications ranging from research and development to semi-custom production. These systems accommodate wafer sizes of 300mm, 200mm, and 150mm and can be customized for dicing film or back grind film lamination. Additionally, these mounting systems are compatible with a variety of substrates, including glass and ceramics, making them suitable for diverse industries. Notable is the twin-type manual wafer mounter, which allows simultaneous application of two tapes, such as an adhesive tape and a UV tape, eliminating the need for tape changes. This functionality enhances efficiency and customization for specific user requirements, providing flexibility and precision in semiconductor processing and related operations.
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We have a wide range of manual wafer mounting systems available for various applications, from research and development to semi-custom production. The manual wafer mounter series supports three different wafer sizes: 300mm, 200mm, and 150mm and can be manufactured for either dicing film or back grind film lamination.

Our manual wafer mounting systems can also be used in packaging, glass, ceramic, and various other types of substrates, and can also be customized to meet special user specifications.

A twin-type manual wafer mounter is also available. With this special model, you can simultaneously set two tapes or films, such as a normal adhesive tape and a UV tape, on a single wafer mounter. This eliminates the need to change tapes.

 
  • Instantaneous bubble-free lamination
  • Built-in automatic balancing mechanism for lamination roller
  • Built-in circular cutter
  • Built-in horizontal cutter
  • Built-in separator winding mechanism
  • Wide variety of options (hot chuck, non-contact surface chuck, measures against static electricity, and more)
 

System Model: Application/Wafer Size
Model FM-2243: For Dicing (300mm / 12″ wafers)
Model FM-2248: For Dicing (200mm / 8″ wafers)
Model FM-2246: For Dicing (150mm / 6″ wafers)
Model FM-2243-BG: For back grind (BG) films (300mm / 12″ wafers)
Model FM-2248-BG: For back grind (BG) films (200mm / 8″ wafers)
Model FM-2246-BG: For back grind (BG) films (150mm / 6″ wafers)