- Home
- Companies
- Axiomtek Co., Ltd.
- Services
- Design Assistance Service
Design Assistance Service
The Design Assistance Service was created to offer indispensable help to achieve critical development tasks in the development process. It can help system designers deal with issues in electric design, heat dissipation, verification tests, production quality control and warranty support. These services will reduce design uncertainty and risk associated with customer`s system integration completion. We have the experience, capability, and R&D resources to make any project a success! We are an extremely versatile turnkey manufacturer with the ability to turn your concepts and ideas into real solutions. Customers can enjoy innovation and fast time-to-market through Axiomtek`s professional design assistance services.
Thermal Solution Service
A successful thermal design can improve the reliability of the system and prevent early stage failures when the products go into the field. Axiomtek`s thermal solutions service can offer flexible and efficient solution by providing proven thermal modules for embedded boards and systems. If a customer chooses to do the work by themselves, we can provide all of the necessary mechanical and thermal information needed to help them complete their project.
Proven thermal module
Axiomtek provides proven heatsink/cooler or system thermal solutions which have been qualified in different temperature condition.
Customized thermal solution
The thermal customization service is available upon request to meet different application environments. Axiomtek can provide a customdesigned heatsink or cooler based on the modularized thermal solution concept.
Design support for customer
Axiomtek has built up a thermal design database to offer customers board-level ME drawings to assist when designing system chassis. System thermal design is the most important task. Axiomtek can provide thermal hot spot images and feasibility studies by using the FloTHERM thermal simulation, which can predict airflow and heat transfer in and around electronic equipment to help reduce design risk and time.