VIEW Semiconductor Wire Bond Applications - Lead Frames - Electronics and Computers

Leadframe inspection presents a wide variety of feature sizes and geometry, requiring metrology systems that can be flexibly programmed for fast and accurate three-dimensional measurements. Die-to-pad placement/alignment, lead positions/sizes, lead tilt and twist angles, pitch, lead widths, lead-coplanarity, and dam-bar dimensions all represent critical factors that must be tightly controlled.