VIEW Semiconductor Wire Bond Applications - Quad Flat Packs (QFP) and Ball Grid Arrays (BGA) - Electronics and Computers - Semiconductors
Quad Flat Pack (QFP) and Ball Grid Array (BGA) components represent metrology challenges with very tight tolerances that can tax the capabilities of even high performance systems.
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Coplanarity, lead width, pitch, ball diameter, package height and warpage, and the need to inspect for damaged or missing balls/leads can all be critical factors. In addition to the needs for versatile lighting and high-performance image processing, effective QFP/BGA inspection also requires integrated laser capabilities for rapid and accurate Z-axis measurements.
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