3D-Micromac AG products

The microPRO™ RTP, a new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing, combines a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor wafer manufacturing platform. It provides selective annealing with high repeatability and throughput in a versatile system. The microPRO™ RTP features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional laser wavelengths.

microSTRUCT™ mini offers: One free configurable working area. Integration of different laser sources. Quick changing of work piece clamping unit. User-friendly, flexible, upgradeable system control. Automatic handling on request.

Cost, quality, and throughput are major factors of success for SiC based devices in the semiconductor industry. 3D-Micromac answers this challenge with its brand-new microDICE™ system. The revolutionary, high-performance microDICE™ laser dicing system brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICE™ separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput.