Bodo Möller Chemie GmbH products

HI-FLOW phase change materials are an excellent replacement for thermal paste and serve as a high-performance thermal interface material between a CPU or other heat generative components and a heat sink. At room temperature, the films are solid and liquify as the board heats up. In doing so, they provide high reliability without a “pump out” effect.

SIL PAD® thermally conductive insulators are a clean and efficient alternative to mica, ceramic or thermal paste and are used on a wide variety of components in the electronics industry.