Bodo Möller Chemie GmbH
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HI-FLOW Phase Change Interface Materials (PCM)

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HI-FLOW phase change materials are an excellent replacement for thermal paste and serve as a high-performance thermal interface material between a CPU or other heat generative components and a heat sink. At room temperature, the films are solid and liquify as the board heats up. In doing so, they provide high reliability without a “pump out” effect.

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HI-FLOW materials are suited for consumer and industrial electronics, automotive, medical, aerospace and telecommunications applications such as:

  • UPS and SMPS AC/DC, DC/DC or linear power supplies
  • Between a CPU and heat sink
  • Power conversion devices
  • Fractional and integral motor control
  • Leaded, surface mount and power module assemblies