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HI-FLOW Phase Change Interface Materials (PCM)
HI-FLOW phase change materials are an excellent replacement for thermal paste and serve as a high-performance thermal interface material between a CPU or other heat generative components and a heat sink. At room temperature, the films are solid and liquify as the board heats up. In doing so, they provide high reliability without a “pump out” effect.
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HI-FLOW materials are suited for consumer and industrial electronics, automotive, medical, aerospace and telecommunications applications such as:
- UPS and SMPS AC/DC, DC/DC or linear power supplies
- Between a CPU and heat sink
- Power conversion devices
- Fractional and integral motor control
- Leaded, surface mount and power module assemblies
