F&S BONDTEC Semiconductor GmbH products

Complete, manual table top bonder, Unbeatable price-to-performance ratio, Extremely adaptable bond settings, loop shapes, force and power profiles etc., Dual wire clamp system for reproduceable loop and tails, Easy handling

Unbeatable flexibility, Changeable bondheads for all wirebond and testing process, Fully automatic bonding with manual part feeding, Store an unlimited number of bond programs, Extremely adaptable bond settings, loop shapes, force and power profiles etc., Most powerful pattern recognition system on the market, Innovative and intuitiv programmable software, Travel distances 100 x 100 mm, 6 in 1

The automatic bond tester 5600Ci complements F&S Bondtec Semiconductor GmbH die- and wire-bonders. It is unique on the world market and patented. The PC controlled moving table allows any number of bonds to be tested automatically from a stored program. Results can be analysed and output immediately or exported in a number of data base formats for subsequent analysis as desired. Powerful extended capabilities enable measurements such as force/time curves to be made and deliver more data about the quality of the bond tested. Exchangeable measurement cartridges ensure rapid conversion to different force ranges. The calibration curves of all measurement cartridges are stored internally; additional heads for shear, peel and tweezer testing with customerspecific tools and jaws are available. After a first programming a reproducible pull- or sheartest can be guaranteed for all following components.

The semi-automatic bond tester 5600i complements F&S’s die and wire bonders. The PC controlled moving table allows any number of bonds to be tested automatically from a stored program. Results can be analysed and output immediately or exported in a number of data base formats for subsequent analysis as desired. Powerful extended capabilities enable measurements such as force/time curves to be made and deliver more data over the quality of the bond tested.