F&S BONDTEC Semiconductor GmbH products

Complete, manual table top bonder, Unbeatable price-to-performance ratio, Extremely adaptable bond settings, loop shapes, force and power profiles etc., Dual wire clamp system for reproduceable loop and tails, Easy handling

Unbeatable flexibility, Changeable bondheads for all wirebond and testing process, Fully automatic bonding with manual part feeding, Store an unlimited number of bond programs, Extremely adaptable bond settings, loop shapes, force and power profiles etc., Most powerful pattern recognition system on the market, Innovative and intuitiv programmable software, Travel distances 100 x 100 mm, 6 in 1