SENTECH Instruments GmbH products

The SENTECH SI 500 ICP-RIE System represents advanced inductively coupled plasma reactive ion etching technology, tailored for both research and industrial applications. Its core feature, the proprietary Planar Triple Spiral Antenna (PTSA) plasma source, offers uniform plasma generation with high ion density and low ion energy, making it ideal for low-damage etching of sensors, quantum dots, and HEMT. The system supports high-rate plasma etching of silicon for MEMS with high aspect ratios using room temperature and cryogenic processes. Dynamic temperature control, achieved through a sophisticated substrate electrode combined with He backside cooling and precise backside temperature sensing, ensures optimal process stability across a wide temperature range. This versatility allows the SI 500 to handle a multitude of materials, including compound semiconductors (GaAs, InP), dielectrics, and metals. The modular design accommodates a variety of substrate sizes and configurations, from single wafer vacuum load locks to complex cluster tools, enabling high flexibility and throughput. Advanced control is provided by a reliable PLC and SIA operating software, supporting robust real-time system management.

SENTECH Instruments GmbH offers advanced Cluster Configurations for Plasma Etching and Deposition, designed to enhance high yield and throughput for semiconductor processing. These systems combine plasma etch and deposition modules with up to two cassette stations, allowing for consistent, high-volume processing of wafers up to 200mm in diameter. The setup includes three to six port transfer chambers suitable for clustering ICP plasma etch systems, RIE etch systems, atomic layer deposition systems, and ICPECVD deposition tools, thereby catering to both research and production needs. The flexibility is enhanced by options for vacuum load lock and cassette station sample loading, along with adaptable carrier handling for different wafer sizes. Reliable real-time control is achieved through advanced hardware and SIA operating software with a client-server architecture, backed by a programmable logic controller (PLC). These Cluster Configurations are modular, supporting various levels of automation and offering solutions for both industry production and research and development settings.