SENTECH - Cluster Configuration for Plasma Etching and Deposition

SENTECH Instruments GmbH offers advanced Cluster Configurations for Plasma Etching and Deposition, designed to enhance high yield and throughput for semiconductor processing. These systems combine plasma etch and deposition modules with up to two cassette stations, allowing for consistent, high-volume processing of wafers up to 200mm in diameter. The setup includes three to six port transfer chambers suitable for clustering ICP plasma etch systems, RIE etch systems, atomic layer deposition systems, and ICPECVD deposition tools, thereby catering to both research and production needs. The flexibility is enhanced by options for vacuum load lock and cassette station sample loading, along with adaptable carrier handling for different wafer sizes. Reliable real-time control is achieved through advanced hardware and SIA operating software with a client-server architecture, backed by a programmable logic controller (PLC). These Cluster Configurations are modular, supporting various levels of automation and offering solutions for both industry production and research and development settings.