Tempress Systems products

The POCl₃ diffusion process is the most suitable and versatile method for creating of an n-type dopant layer. Based on 40 years of experience, Tempress has established a POCl₃ diffusion platform capable of delivering the most stable, reproducible and versatile process conditions at the lowest cost of ownership.

Tempress has developed an alternative atmospheric process called High Density POCl₃. The HD system benefits from the throughput advantage of small pitch, back-to-back, and long flatzone. Using improved chemistry and hardware adaptions, excellent uniformity and efficiencies are obtained at Tier one customers. With the HD-POCl₃ diffusion process, Tempress has focused on process innovation to increase throughput without the drawbacks (high cost / high maintenance) of complex low pressure systems. The HD-POCl₃ process is supplied within Tempress’ improved 5-stack system platform.

Tempress is world market leader in the production of diffusion furnace systems for Boron diffusion (BBr₃). With 1.5 GW_p installed base, we are a valuable partner for the n-type solar cell manufacturing industry. For p-type surface doping of n-type  silicon, BBr₃ diffusion is one of the most simple and cost-effective solutions. BBr₃ diffusion offers an integrated solution of deposition of a BSG diffusion source layer and actual thermal diffusion of boron from this layer into the silicon. Tempress BBr₃ diffusion systems are designed and built based on many years of semiconductor and solar photovoltaic industry experience.

The Small Batch Vertical Furnace (SBVF) can process wafers up to 200 mm. The dual tube vertical furnace is loaded by a single wafer robot system. This system allows sequential processing, with wafers being transferred from one process tube to the other in inert atmosphere.

Over the past 45 years, Tempress has built up an world wide installed base of over 1800 furnace systems. Most of these systems are dedicated for the Semiconductor industry. During this long history, Tempress was able to built up extensive hardware and process know-how. The TS 6 & TS 8 series Small Batch Furnace systems can be equipped with a wide range of processes in various set ups,

Tempress SPECTRUM is a batch-type PECVD system for SiOx and SiNx deposition on silicon solar cells. It uses the benefits of a direct plasma system (i.e. excellent emitter passivation, dense and closed layer deposition, low tool maintenance) while maintaining good color uniformities.

The Tempress SPECTRUM LPCVD Poly system is used for in-situ oxide and poly deposition in a so-called ‘TopCon’ solar cell. The system is capable of depositing both undoped and in-situ doped polysilicon, with uniform deposition over the entire batch. The SPECTRUM LPCVD system allows the ‘TopCon’ process flow to be run with high throughput and low cost of ownership, as is demonstrated by Tier 1 customers that use the system in high volume manufacturing.

The TS series is Tempress’ versatile horizontal furnace system that is configurable to meet our customer demands in the semiconductor, solar, MEMS and photonics industries. Its use ranges from small batch R&D and pilot line production purposes, to high volume manufacturing processing. Tempress R&D systems are used in many advanced research centers worldwide, with state of the art proccesses and continuously new process developments.